12mm 80W 400nm Flip chip UV SMD LED Module Specs:
| 12mm 80W 400nm Flip chip UV SMD LED Module | |
| GD-1212P400-12C3D-J1D5B | |
| Taiwan Epistar 45mil flip chip | |
|
36-40vdc max 2100mA |
|
|
30000-40000mW at 2100mA |
|
|
400-410nm UV wavelength |
|
|
Max 80 Watt at 2100mA |
|
| ALN Ceramic size 12x12mm | |
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120 degree |
|
| 4 years | |
|
1. SKD parts available; 2. Customised LED array with the size you need is OK here. |
What are the advantages of flip-chip UV LED packaging compared to traditional wire-bonded UV LED packaging?
Flip-chip UV LED packaging offers several advantages over traditional wire-bonded UV LED packaging:
: Flip-chip packaging allows direct contact between the chip and the heat sink, improving heat dissipation.
: Flip-chip packaging reduces light loss in the packaging materials, enhancing light output efficiency.
: Flip-chip packaging minimizes the use of gold wires, reducing the risk of failure due to wire breakage.
: Flip-chip packaging enables smaller package sizes, making it suitable for high-density integration applications.
12mm 80W 400nm Flip chip UV SMD LED Module Picture:
12mm 80W 400nm Flip chip UV SMD LED Module dimensions:
12mm 80W 400nm Flip chip UV SMD LED Module specs:
|
VF |
IF=2100mA |
36.00 |
-- |
39.00 |
V |
|
|
RΘJ-B |
IF=2100mA |
-- |
2 |
-- |
||
|
Φe |
IF=2100mA |
30000 |
−− |
40000 |
||
|
λp |
IF=2100mA |
400 |
−− |
410 |
||
|
IR |
VR=60V |
−− |
−− |
10 |
μ A |
|
|
|
2Θ1/2 |
IF=2100mA |
−− |
120 |
−− |
12mm 80W 400nm Flip chip UV SMD LED Module
12mm 80W 400nm Flip chip UV SMD LED Module, especially one made with a ceramic base for efficient heat dissipation and durability, is typically used in applications where high-intensity UV light is needed for effective curing and processing. The main applications include:
:
:
Ideal for curing UV-sensitive adhesives used in electronics, automotive, medical devices, and other precision manufacturing industries.
3D Printing:
Utilized in SLA (Stereolithography) and DLP (Digital Light Processing) 3D printing for curing photopolymer resins layer by layer.
Allows for the production of high-precision 3D printed parts with smooth surfaces.
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:
Used to cure UV-sensitive paints, coatings, and adhesives in manufacturing, providing strong, durable bonds and surface protection.
Beneficial in high-volume automotive production lines due to its fast-curing properties.
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The ceramic base of the 200W UV LED module helps in efficient heat dissipation, ensuring longer operational life and consistent performance under high-power conditions, making it ideal for demanding, continuous-use environments.
CE-LVD
ISO9001
LM-80
Shenzhen Guangmai Electronics Co., Ltd., established in 2009 with a registered capital of 30 million RMB, is an enterprise specializing in the manufacturing of semiconductor packaging devices. Its subsidiaries include Shenzhen Guangmai Technology Co., Ltd., Guangmai Technology (Hong Kong) Co., Ltd., and Shenzhen OKAY Lighting Co., Ltd., forming a powerful corporate group. Guangmai Electronics is a national high-tech enterprise and a specialized and new enterprise in Shenzhen. It has been ranked among the top 100 in China's LED industry and has been awarded honors such as Shenzhen Standard Application Demonstration Unit and Guangdong Integrity Demonstration Enterprise.
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